The world's appetite for analyzing massive amounts of structured and unstructured data has
grown dramatically. The computational demands of these abundant-data applications, such …

The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the
Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram …

Gas-permeable membranes (GPMs) and membrane-like micro-/nanostructures offer precise
control over the transport of liquids, gases, and small molecules on microchips, which has …

Abstract The Microfluidic, Extreme heat flux, CMOS compatible, Heat-eXchanger (MECH-X)
is an embeddable silicon-based reactor-style heat sink which has been experimentally …

Heat spreading is critical in reducing the overall junction temperature of monolithic system-
on-chips (SoCs) and high-heat-flux radio frequency (RF) applications. Bulk diamond has the …

This article focuses on chip-scale single-phase cooling for high heat flux and high
temperature power device operation. This technology is focused on future wide band-gap …

The increasing power densities of electronic devices due to more compact package
requirements make their thermal management a major challenge. Adequate cooling of these …

Flow boiling offers increased heat transfer coefficients and effective heat capacity rates that
can be leveraged by topology optimization (TO) to generate high-performance microchannel …

Performance enhancement of the two-phase flow boiling heat transfer process in
microchannels through implementation of surface micro-and nanostructures has gained …

The increasing heat densities in electronic components and focus on energy efficiency have
motivated utilization of embedded two-phase cooling, which reduces system-level thermal …