With the technological advancement in micro-electro-mechanical systems (MEMS),
microfabrication processes along with digital electronics together have opened novel …

The heterogeneous integration of III–V devices with Si-CMOS on a common Si platform has
shown great promise in the new generations of electrical and optical systems for novel …

An overview of microelectromechanical systems (MEMS) resonators for frequency reference
and timing applications is presented. The progress made in the past few decades in design …

This paper presents a new method for wafer-level hermetic packaging of MEMS devices
using a relatively low temperature anodic bonding technique applied to the recently …

This letter reports temperature compensated single crystal silicon (SCS) bulk-mode
capacitive microelectromechanical system (MEMS) resonators with high temperature …

A high quality factor (Q) and low-impedance aluminum nitride (AIN) on silicon piezoelectric
resonator is reported in this paper. The piezoelectric resonator is fabricated based on the …

In this article, a new approach by introducing auxiliary structures in the tethers of a
microelectromechanical system (MEMS) resonator is presented to reduce anchor loss. A …

In this paper, the design, modeling and characterization of width-extensional (WE) mode
piezoelectric microelectromechanical systems (MEMS) resonators are presented. The …

This paper reports a novel and inherently simple fabrication process, so-called advanced
MEMS (aMEMS) process, that is developed for high-yield and reliable manufacturing of …

There has been considerable interest in low-temperature in-situ integration techniques for
the fabrication of hetero-structured substrates and micro/nanosystems. This study presents a …