A novel interposer channel structure with vertical tabbed vias to reduce far-end crosstalk for next-generation high-bandwidth memory

H Kim, S Lee, K Song, Y Shin, D Park, J Park, J Cho… - Micromachines, 2022 - mdpi.com
In this paper, we propose and analyze a novel interposer channel structure with vertical
tabbed vias to achieve high-speed signaling and low-power consumption in high-bandwidth …

Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board

K Song, J Kim, H Kim, S Lee, J Ahn, A Brito, H Kim… - Electronics, 2021 - mdpi.com
It is necessary to reduce the crosstalk noise in high-speed signaling channels. In the
channel routing area, the tabbed routing pattern is used to mitigate far-end crosstalk (FEXT) …

Prepreg and Core Dielectric Permittivity (ϵr) Extraction for Fabricated Striplines' Far-End Crosstalk Modeling

S Yong, S Penugonda, DH Kim… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
As the data rate and density of digital high-speed systems are getting higher, far-end
crosstalk (FEXT) noise becomes one of the major issues that limit signal integrity …

A high-density and low-crosstalk differential pin map for 112 Gb/s PAM4 applications

MS Zhang - IEEE Microwave and Wireless Components Letters, 2022 - ieeexplore.ieee.org
The rapidly growing demand for high-bandwidth data rate has pushed the wireline
communications speed up to 112 Gb/s. In such high-speed and high-channel-count …

Far-end crosstalk analysis for stripline with inhomogeneous dielectric layers (IDL)

Y Liu, S Yong, Y Guo, J He, L Liu… - … Joint EMC/SI/PI and …, 2021 - ieeexplore.ieee.org
Far-end crosstalk (FEXT) noise is a critical factor that affects signal integrity performance in
high-speed systems. The FEXT level is sensitive to the dielectric inhomogeneity of the …

Hardware verification of via crosstalk cancellation for differential BGA-to-BGA links

K Scharff, X Duan, M Cocchini… - 2022 IEEE 31st …, 2022 - ieeexplore.ieee.org
Coupling in dense via pinfields is known as a major contributor to crosstalk. In this work we
present and verify a novel wiring strategy for links with a symmetrical pinfield-to-pinfield …

Novel Formulations of Multireflections and Their Applications to High-Speed Channel Design

M Ouyang, XD Cai, B Pu, Q Gao… - … on Signal and …, 2022 - ieeexplore.ieee.org
Reflection theory has been long established for over decades targeted at microwave and
radio frequency (RF) applications. With ultra-high-bandwidth applications emerging, such as …

Differential via designs for crosstalk reduction in high-speed PCBs

J Wang, C Xu, S Zhong, S Bai, JJ Lee… - … Compatibility & Signal …, 2020 - ieeexplore.ieee.org
With an increased data rate of high-speed PCBs, an increase in crosstalk degrades the
signal integrity of the highspeed system. In most PCB designs, via-to-via coupling has the …

Estimation of Reference Impedance in 2x-thru De-embedding With High Conductor-Loss Lines

CC Chou - IEEE Transactions on Electromagnetic Compatibility, 2024 - ieeexplore.ieee.org
The 2x-thru de-embedding has emerged as an attractive alternative to the classical TRL for
S parameter measurement of printed circuit board and packaging devices, mainly due to its …

Distribution Optimization of Through-Silicon Via (TSV) Array Based on Genetic Algorithm

JY Ju, QQ Liu, P Zhang, J Wang, P Zhao… - IEEE Transactions …, 2025 - ieeexplore.ieee.org
Through-silicon via (TSV) has attracted much attention due to its numerous advantages
including high-density interconnection, low power consumption, and wide bandwidth. When …