DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: a simulation study
This work investigates the impact of different types of interface trap charges (ITCs) on
electrical parameters of split source horizontal pocket Z shape TFET (ZHP-TFET) and Hetero …
electrical parameters of split source horizontal pocket Z shape TFET (ZHP-TFET) and Hetero …
Noise behavior of vertical tunnel FETs under the influence of interface trap states
VD Wangkheirakpam, B Bhowmick… - Microelectronics …, 2021 - Elsevier
A detailed analysis of low frequency noise behavior of two different vertical TFETs namely
n+ pocket VTFET and dual MOS capacitor (D-MOS) VTFET is presented in this work …
n+ pocket VTFET and dual MOS capacitor (D-MOS) VTFET is presented in this work …
Impact of temperature and interface trapped charges variation on the Analog/RF and linearity of vertically extended drain double gate Si0. 5Ge0. 5 source tunnel FET
This work analyses the reliability issues of vertically extended drain double gate Si 1− x Ge x
source tunnel FET on the basis of temperature effect and interface charge effects. The …
source tunnel FET on the basis of temperature effect and interface charge effects. The …
Effect of noise components on L-shaped and T-shaped heterojunction tunnel field effect transistors
This paper reports on a comparative study of the analysis of electrical noise of
heterojunction tunnelling-field-effect-transistors with an L-shaped gate (LTFET) and with a T …
heterojunction tunnelling-field-effect-transistors with an L-shaped gate (LTFET) and with a T …
Linearity performance and intermodulation distortion analysis of D-MOS vertical TFET
Recent trend researches provide potential results of tunnel field effect transistors (TFETs) for
being used in many electronic circuit applications. This work studies the comparative …
being used in many electronic circuit applications. This work studies the comparative …
Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique
An extraction method of the interface-trap densities (Dit) of the stacked bonding structure in
3D integration using high-frequency capacitance–voltage technique is proposed. First, an …
3D integration using high-frequency capacitance–voltage technique is proposed. First, an …
Vertical Tunnel FET Technology: Optimization and Reliability Perspective
VD Wangkheirakpam, B Bhowmick… - 2021 International …, 2021 - ieeexplore.ieee.org
This work reports the fundamental concepts on n+ pocket Vertical Tunnel FET (VTFET). An
optimization strategy that is applicable to any TFET geometry is presented to optimize its …
optimization strategy that is applicable to any TFET geometry is presented to optimize its …
Vertical Tunnel FET Having Dual MOSCAP Geometry
VD Wangkheirakpam, B Bhowmick… - Sub-Micron …, 2022 - taylorfrancis.com
This chapter presents the vertical tunnel field-effect transistor (V-TFET) with dual metal oxide
semiconductor capacitor (MOSCAP) geometry and analyses of various aspects related to it …
semiconductor capacitor (MOSCAP) geometry and analyses of various aspects related to it …
[引用][C] 7 Vertical Tunnel FET
HD MOSCAP, VD Wangkheirakpam… - … Devices: Design and …, 2022 - CRC Press