Power cycling test methods for reliability assessment of power device modules in respect to temperature stress

UM Choi, F Blaabjerg… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Power cycling test is one of the important tasks to investigate the reliability performance of
power device modules in respect to temperature stress. From this, it is able to predict the …

An investigation of temperature-sensitive electrical parameters for SiC power MOSFETs

JO Gonzalez, O Alatise, J Hu, L Ran… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
This paper examines dynamic temperature-sensitive electrical parameters (TSEPs) for SiC
MOSFETs. It is shown that the switching rate of the output current (dI DS/dt) coupled with the …

Condition monitoring: A decade of proposed techniques

Y Avenas, L Dupont, N Baker, H Zara… - IEEE Industrial …, 2015 - ieeexplore.ieee.org
Power conversion systems are dependent on the performance and reliability of static
converters. However, they are subject to frequent functional and environmental strains …

Gate–emitter pre-threshold voltage as a health-sensitive parameter for IGBT chip failure monitoring in high-voltage multichip IGBT power modules

R Mandeya, C Chen, V Pickert… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
This paper proposes a novel health-sensitive parameter, called the gate-emitter pre-
threshold voltage VGE (pre-th), for detecting IGBT chip failures in multichip IGBT power …

[PDF][PDF] 基于老化补偿的功率模块全生命周期在线结温监测方法

郑丹, 宁圃奇, 仇志杰, 范涛, 温旭辉 - 电工技术学报, 2024 - dgjsxb.ces-transaction.com
摘要功率模块结温在线监测对提升系统性能和可靠性具有重要意义. 应用导通饱和压降和电流对
结温进行估计, 对测量带宽要求不高, 对硬件和算法的侵入性低, 是比较理想的结温在线监测方法 …

Evaluating different implementations of online junction temperature sensing for switching power semiconductors

H Niu, RD Lorenz - IEEE Transactions on Industry Applications, 2016 - ieeexplore.ieee.org
Switching power semiconductor online junction temperature T j sensing is essential for
device switching performance evaluation, device switching control, and device lifetime …

Dynamic electrothermal model of paralleled IGBT modules with unbalanced stray parameters

Y Tang, H Ma - IEEE Transactions on Power Electronics, 2016 - ieeexplore.ieee.org
Compared with single-module applications, unbalanced stray parameters come about
frequently in the process of installing paralleled IGBT modules, which could result in some …

Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests

S Fu, Y Mei, X Li, C Ma, GQ Lu - IEEE Transactions on Power …, 2016 - ieeexplore.ieee.org
Nanosilver paste has become a promising lead-free die-attach material for power electronic
packaging. This development solves the challenges faced by power device manufacturers to …

Thermal stress analysis comparison in IGBT power modules between DC and switching power cycling

Z Khatir, R Lallemand, A Ibrahim… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
The purpose of this article is to show and highlight the observed differences in power cycling
test results between dc and switching modes. The focus is done in the generated thermal …

A Comprehensive Overview of Reliability Assessment Strategies and Testing of Power Electronics Converters

F Hosseinabadi, S Chakraborty, SK Bhoi… - IEEE Open Journal …, 2024 - ieeexplore.ieee.org
Power electronics converters (PECs) are responsible for efficiently converting electrical
energy between power generators, storage systems and power consumers/loads. The PECs …