Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
Rheological properties and thermal conductivity of epoxy resins filled with a mixture of alumina and boron nitride
VD Mai, DI Lee, JH Park, DS Lee - Polymers, 2019 - mdpi.com
Electronic packaging materials with high thermal conductivity and suitable viscosity are
necessary in the manufacturing of highly integrated electronic devices for efficient heat …
necessary in the manufacturing of highly integrated electronic devices for efficient heat …
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches
Consistent with the recent trends in which the flip-chip reliability and performance being
prominently prioritized, this paper is devoted to study the effects of solder bump shapes on …
prominently prioritized, this paper is devoted to study the effects of solder bump shapes on …
Regional segregation with spatial considerations-based analytical filling time model for non-Newtonian power-law underfill fluid in flip-chip encapsulation
This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …
underfill fluid during flip-chip encapsulation process. The current model is formulated based …
Spatial analysis of underfill flow in flip-chip encapsulation
Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
Study on the addition of nanoparticles in the lead-free solder during reflow soldering via numerical simulation-a review
IN Sahrudin, MSA Aziz, MZ Abdullah… - CFD Letters, 2020 - akademiabaru.com
Surface mount technology (SMT) is a method of electronic components mounting or placed
directly on the surface of the circuit board. The solder will be printed onto the substrate on …
directly on the surface of the circuit board. The solder will be printed onto the substrate on …
Preparation of Al2O3 magnetic abrasives by gas-solid two-phase double-stage atomization and rapid solidification
Y Gao, Y Zhao, G Zhang - Materials Letters, 2018 - Elsevier
This paper describes the production of Al 2 O 3 magnetic abrasives via a double-stage
atomization method. The matched pressures of atomization were simulated via Ansys-Fluent …
atomization method. The matched pressures of atomization were simulated via Ansys-Fluent …
Filling efficiency of flip-chip underfill encapsulation process
Purpose This paper aims to introduce a new indicative parameter of filling efficiency to
quantify the performance and productivity of the flip-chip underfill encapsulation process …
quantify the performance and productivity of the flip-chip underfill encapsulation process …
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations
D Kim, J Park, J Jang, H Yang, K Kim, C Oh… - Microelectronics …, 2023 - Elsevier
This study experimentally and numerically investigated the endurance life and mechanical
behavior of the ball grid array (BGA) packages according to the presence of underfill and the …
behavior of the ball grid array (BGA) packages according to the presence of underfill and the …
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …