Ever since the start of the electronic age, soldering has been an important interconnecting
method in microelectronic packaging. Since the 1960 s, development of information …

The corrosion properties of lead-free solder alloy can not be ignored in the field of the
electronic industry. However, there is no literature on the effect of aluminium on Sn-In binary …

In this work, the lead-free composite solder was fabricated by mixing Ni element with Sn–0.7
Cu–10Bi solder. The effect of nickel (Ni) addition on the growth behavior of intermetallic …

The effect of Cu addition on potentiodynamic and static immersion corrosion behavior of Sn-
9Zn-xCu (x= 0, 1, 2, 3 wt%) was evaluated for their application in the electronic industry …

This study investigates the effect of aluminum (Al) on the microstructure, micro-hardness,
and wettability of environmentally friendly Sn-20Bi-xAl (x= 0, 0.1, 0.3, 0.5 (wt.%)) solder …

The use of Al for replacing high-cost alloying metals, like Ag, Bi, and Cu, as the second
major element in Sn-based alloys, arises as a promising alternative for the development of …

Low-temperature bonding of 7075 Al alloy with metal foam/Sn composite solder was
achieved under ultrasound conditions. The effects of metal foam compositions and soldering …

Sn-0.7 Cu-0.075 Al solder alloy adding with Ce and La had been successfully prepared by
applying ball-milling and vacuum arc remelting. The influence of Ce and La on …

The effect of aluminum on the microstructure and mechanical properties of Sn–0.7 Cu–xAl
(x= 0–0.075) solder alloy is investigated. The results show that the microstructure of Sn–Cu …

It is important to develop Pb-free solder alloys suitable for automotive use instead of
traditional Sn–Pb solder due to environmental regulations (eg, Restriction of Hazardous …