Scalable fabrication of nanogratings on GaP for efficient diffraction of near-infrared pulses and enhanced terahertz generation by optical rectification

M Bashirpour, W Cui, A Gamouras, JM Ménard - Crystals, 2022 - mdpi.com
We present a process flow for wafer-scale fabrication of a surface phase grating with sub-
micron feature sizes from a single semiconductor material. We demonstrate this technique …

Overview of materials and processes for lithography

RA Lawson, APG Robinson - Frontiers of nanoscience, 2016 - Elsevier
Computers and other electronic devices are an integral and ubiquitous part of the modern
world. One of the key drivers for the development, power, cost, and availability of these …

[HTML][HTML] Fullerene-based spin-on-carbon hardmask

A Frommhold, J Manyam, RE Palmer… - Microelectronic …, 2012 - Elsevier
As feature sizes have diminished the need for extremely thin photoresist films has grown.
Given the poor selectivity of typical resists with respect to silicon during plasma etching, it …

Dimension and process effects on the mechanical stability of ultra-small HSQ nanopillars

P Zeng, Z Feng, M Zheng, X Gao, S Zhang… - Journal of Nanoparticle …, 2021 - Springer
The demand for ever-smaller devices increases with the development of the semiconductor
industry. High-resolution patterning based on lithography is significant to fabricate ultra …

Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer

I Seshadri, A De Silva, L Meli, C Liu… - Extreme Ultraviolet …, 2017 - spiedigitallibrary.org
Initial readiness of EUV patterning has been demonstrated at the 7-nm device node with the
focus now shifting to driving the'effective'k1 factor and enabling the second generation of …

High aspect ratio etching using a fullerene derivative spin-on-carbon hardmask

A Frommhold, J Manyam, RE Palmer… - … Etch Technology for …, 2012 - spiedigitallibrary.org
As lithographic resolution has increased to meet the demand for smaller devices it has been
necessary to use extremely thin photoresist films to mitigate aspect ratio related resist …

Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer

I Seshadri, AD Silva, L Meli, C Liu… - Journal of Micro …, 2017 - spiedigitallibrary.org
Initial readiness of extreme ultraviolet (EUV) patterning has been demonstrated at the 7-nm
device node with the focus now shifting to driving the “effective” k1 factor and enabling the …

Spin-on carbon based on fullerene derivatives as hardmask materials for high-aspect-ratio etching

A Frommhold, RE Palmer… - Journal of Micro …, 2013 - spiedigitallibrary.org
The advance of lithographic resolution has made it necessary to adopt extremely thin
photoresist films for the fabrication of “2× nm” structures in order to mitigate problems such …

Nanoscale modulus and surface chemistry characterization for collapse free resists

PK Kulshreshtha, K Maruyama, S Kiani… - … Process Control for …, 2013 - spiedigitallibrary.org
One of the key challenges to high resolution resist patterning is pattern collapse. Using a
new scanning probe microscopy (SPM), Peak Force TM tapping, we map nano-mechanical …

Integration and characterisation of superconducting thin films and high spin orbit coupling InSb 2DEGs

T Robinson - 2023 - orca.cardiff.ac.uk
One theoretical route towards fault proof quantum computing is the realisation of Majorana
Zero Modes (MZMs) at the ends of InSb nanowires coupled to conventional s-wave …