Recent advances in reactive ion etching and applications of high-aspect-ratio microfabrication
M Huff - Micromachines, 2021 - mdpi.com
This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-
aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro-and …
aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro-and …
A review on the mainstream through-silicon via etching methods
H Guo, S Cao, L Li, X Zhang - Materials Science in Semiconductor …, 2022 - Elsevier
Currently, 3D integration is considered to be the most promising development direction
forchip industry. It relies on the through-silicon via (TSV) structure to achieve mechanical …
forchip industry. It relies on the through-silicon via (TSV) structure to achieve mechanical …
[HTML][HTML] A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-Si-via and solder bumping …
DH Cho, SM Seo, JB Kim, SH Rajendran, JP Jung - Metals, 2021 - mdpi.com
With the continuous miniaturization of electronic devices and the upcoming new
technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation …
technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation …
[HTML][HTML] Coupling silicon lithography with metal casting
Micron-scale shaped 2D or 2.5 D structures made of silver or copper can be produced by
combining silicon photolithographic etching with metal casting by pressure infiltration. This …
combining silicon photolithographic etching with metal casting by pressure infiltration. This …
Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review
YJ Jang, A Sharma, JP Jung - Materials, 2023 - mdpi.com
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …
Research of Vertical via Based on Silicon, Ceramic and Glass
W Tian, S Wu, W Li - Micromachines, 2023 - mdpi.com
With the increasing demand for high-density integration, low power consumption and high
bandwidth, creating more sophisticated interconnection technologies is becoming …
bandwidth, creating more sophisticated interconnection technologies is becoming …
[HTML][HTML] Bias-supply timing tailored to the aspect ratio dependence of silicon trench etching in Ar plasma with alternately injected C4F8 and SF6
T Yoshie, K Ishikawa, SN Hsiao, T Tsutsumi… - Applied Surface …, 2023 - Elsevier
In semiconductor device fabrication, the feature profiles of a high-aspect-ratio (HAR) Si
trench is needed to be controlled considering aspect-ratio-dependent etching (ARDE). This …
trench is needed to be controlled considering aspect-ratio-dependent etching (ARDE). This …
Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications
In this article, shielded and airgap-isolated through-silicon vias (TSVs) are fabricated and
measured up to 50 GHz. The unique TSV configuration is low-loss and electrically shielded …
measured up to 50 GHz. The unique TSV configuration is low-loss and electrically shielded …
Gas-Delivery Fluid-Mechanical Timescales in Semiconductor Manufacturing
E Gonzalez-Juez - IEEE Transactions on Semiconductor …, 2023 - ieeexplore.ieee.org
Semiconductor manufacturing demands a fast delivery of multiple gases to the tool. Hence
this document provides formulas for the fluid-mechanical timescales of this delivery. This is …
this document provides formulas for the fluid-mechanical timescales of this delivery. This is …
[HTML][HTML] A method for cleaning flat punch diamond microprobe tips
J Everaerts, A Slagter, A Mortensen - Micron, 2022 - Elsevier
Microprobe tips are commonly used to perform in-situ micromechanical tests within an
electron microscope. In service, such tips have a tendency to accumulate along their surface …
electron microscope. In service, such tips have a tendency to accumulate along their surface …