Hydrogen, a clean and versatile energy carrier, has gained significant attention as a
potential solution for addressing the challenges of climate change and energy sustainability …

Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic
packaging applications. Ag NPs have emerged as a promising low-temperature bonding …

The photocatalytic degradation of resistant antibiotics based on bimetallic alloys is
considered an influential way for waste water treatment. In this work, nanoparticles of a …

Metallic conductive nanoink with the sensitivity of temperature, oxygen, and electrochemical
migration is a great challenge for printed electronics. Here, the size-controllable Cu@ Ag …

Low-temperature copper (Cu) sinter-joining technology has attracted increasing attention in
high-power electronic device packaging because of its low material cost, good electrical and …

Due to the rapid development of multifunctional and miniaturized electronic devices, the
demand for polymer composites with mechanical properties, high‐thermal conductivity, and …

Nano-silver paste is a promising alternative of high temperature solder material for the next
generation electronic devices, which is composed of organic solvent and silver …

Silicon carbide (SiC) devices have shown definite advantages over Si counterparts in high-
temperature, high-voltage, and high-frequency applications. To fully exploit the potentiality of …

The development of next-generation power electronics requires the semiconductor power
devices with higher voltage endurance, higher electrical current density under high …

Diamond has the highest thermal conductivity among naturally occurring materials and a
relatively low coefficient of thermal expansion (CTE), making it a promising interconnected …