Methods and apparatus relating to deterministic management of dynamic thermal response
of processors are described. In one embodiment, available thermal headroom may be used …

Techniques are disclosed for increasing reliability of an integrated circuit. In one
embodiment, an integrated circuit includes core chip circuitry. The integrated circuit includes …

US7200762B2 - Providing a low-power state processor voltage in accordance with a
detected processor type - Google Patents US7200762B2 - Providing a low-power state …

BACKGROUND A power Supply is a premise for various electronic devices to work
normally, and therefore, a power Supply apparatus appears to be particularly important in …

Embodiments of an electronic device and method are dis closed herein. One embodiment of
the electronic device comprises a power Supply and a processor circuit. The power Supply …

The disclosure is related to a method for transforming voltage identification codes of a
microprocessor. The method comprises the steps of: receiving a first voltage identification …

US12131966B2 - Semiconductor wafer and method of manufacturing semiconductor apparatus -
Google Patents US12131966B2 - Semiconductor wafer and method of manufacturing …

H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,
OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY …

(57) ABSTRACT A semiconductor substrate includes a surface having a groove. The groove
includes an inner bottom surface and an inner wall surface. The inner wall surface has a …

Abstract Systems and methods for adjusting component voltage are disclosed. One example
method includes: reading, over a control bus, a present value of voltage supplied to a …