The inhibition of condensation freezing under extreme conditions (ie, ultra-low temperature
and high humidity) remains a daunting challenge in the field of anti-icing. As water vapor …

The realization of liquid metal‐based wearable systems will be a milestone toward high‐
performance, integrated electronic skin. However, despite the revolutionary progress …

Power generation by converting energy from the ambient environment using electric
generators is a promising strategy for development of autonomous self-powered …

In this study, the effects of sintering aids (CaO, TiO 2, La 2 O 3 and ZrO 2) on the physical
and mechanical properties and microstructure of alumina ceramics made by …

Future electronic skin systems require stretchable conductors and low‐temperature
integration of external components, which remains challenging for traditional metal films …

Ag–Cu bimetallic nanoparticles, combining the advantages of both Ag and Cu, are a
promising material for power electronic packaging. In this work, a supersaturated Ag–7.3 …

With the growing joining requirements of emergent engineering materials and new
applications, conventional welding continues to evolve at all scales spanning from the …

In this work, an organic-free silver nanostructured film (SNF) was applied to bond SiC chips
and ceramic substrates, which was fabricated by ultrafast pulsed laser deposition (PLD) …

Thermal stress caused by the coefficients of thermal expansion (CTE) mismatch of materials
is the main failure mechanism in power electronic packaging. High junction temperature (T j) …

Silver electrochemical migration causing short-circuit could be mitigated by Ag-Pd alloy. The
conventional mechanical mixed Ag and Pd nanoparticles requires high alloying temperature …