Recent developments on epoxy-based thermally conductive adhesives (TCA): a review
The development of new polymer-based conductive adhesives with specific performances
and improved conductivity are increasingly critical for thermally interface material (TIM) …
and improved conductivity are increasingly critical for thermally interface material (TIM) …
Characterization of a hybrid Cu paste as an isotropic conductive adhesive
YS Eom, KS Choi, SH Moon, JH Park, JH Lee… - ETRI …, 2011 - Wiley Online Library
As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder,
solder powder, and a fluxing resin system, has been quantitatively characterized. The …
solder powder, and a fluxing resin system, has been quantitatively characterized. The …
Characterization of fluxing and hybrid underfills with micro‐encapsulated catalyst for long pot life
For the fine‐pitch application of flip‐chip bonding with semiconductor packaging, fluxing and
hybrid underfills were developed. A micro‐encapsulated catalyst was adopted to control the …
hybrid underfills were developed. A micro‐encapsulated catalyst was adopted to control the …
Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
KS Jang, YS Eom, KS Choi, HC Bae - Polymer International, 2018 - Wiley Online Library
For electrical interconnections in semiconductor packaging, epoxy‐based pastes have
recently attracted considerable interest due to their excellent adhesion to various substrates …
recently attracted considerable interest due to their excellent adhesion to various substrates …
Simultaneous transfer and bonding (SITRAB) process for Micro-LEDs using laser-assisted bonding with compression (LABC) process and SITRAB adhesive
KS Choi, J Joo, YS Eom, GM Choi… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
The transfer process of moving individual micro-LED chips to a display substrate has been
regarded as the biggest technical obstacle for the commercialization of displays based on …
regarded as the biggest technical obstacle for the commercialization of displays based on …
Development of stacking process for 3D TSV (through silicon via) structure using laser
KS Choi, WA Braganca, KS Jang… - International …, 2017 - meridian.allenpress.com
TSV chips were designed and fabricated to investigate the effects of the types of the stacking
process on the manufacturability. Two processes were compared: thermocompression and …
process on the manufacturability. Two processes were compared: thermocompression and …
Thermochemical mechanism of the epoxy-glutamic acid reaction with Sn-3.0 Ag-0.5 Cu solder powder for electrical joining
GM Choi, KS Jang, KS Choi, J Joo, HG Yun, C Lee… - Polymers, 2021 - mdpi.com
An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes
to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the …
to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the …
Interconnection process using laser and hybrid underfill for LED array module on PET substrate
KS Choi, WAB Junior, KS Jang… - 2018 IEEE 68th …, 2018 - ieeexplore.ieee.org
Flexible displays and electronics are emerging technology. A PET substrate is one the
strong candidate substrate materials for the applications, however, its low thermal stability …
strong candidate substrate materials for the applications, however, its low thermal stability …
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
HC Bae, H Lee, KS Choi, YS Eom - ETRI Journal, 2013 - Wiley Online Library
A cost‐effective and simple solder on pad (SoP) process is proposed for a fine‐pitch
microbump interconnection. A novel solder bump maker (SBM) material is applied to form a …
microbump interconnection. A novel solder bump maker (SBM) material is applied to form a …
Sn58Bi Solder Interconnection for Low‐Temperature Flex‐on‐Flex Bonding
H Lee, KS Choi, YS Eom, HC Bae, JH Lee - Etri Journal, 2016 - Wiley Online Library
Integration technologies involving flexible substrates are receiving significant attention
owing the appearance of new products regarding wearable and Internet of Things …
owing the appearance of new products regarding wearable and Internet of Things …