An integrated circuit (IC), or chip, is a set of electronic circuits and components placed on a
tiny planar silicon (Si) semiconductor substrate. These electronics circuits and components …

The development of integrated circuits and packaging technology has led to smaller and
smaller transmission line sizes and higher and higher operating frequencies up to nearly …

A CMOS inverter driven equivalent single conductor model of capacitively coupled mixed
CNT bundle (MCB) interconnects are taken to analyze the crosstalk induced time domain …

In planar on-chip copper interconnects, conductor losses due to surface roughness
demands explicit consideration for accurate modeling of their performance metrics. This is …

The transient response, 3 dB bandwidth, and relative stability of undoped‐and doped‐
multilayer graphene nanoribbon (MLGNR) interconnects are investigated based on the …

Scattering source‐based mean free path (MFP) and circuit modeling are proposed for three
different configurations of undoped multilayer graphene nanoribbon (U‐MLGNR)(viz …

This paper analyzes the impact of high-frequency phenomena on the operational
characteristics of intercalation-doped horizontal top-contact multilayer graphene nanoribbon …

A Cu–carbon hybrid interconnect was recently proposed as an alternate interconnect
structure for future VLSI applications because of its superior electrical performance over its …

At sub-22nm technology nodes, size effects play a prominent role in the performance
degradation of Cu interconnects. Several scattering mechanisms contribute to size effects …

Aggressive scaling of on-chip interconnects results in significantly higher coupling
capacitance, which results in crosstalk effects as we enter the end-of-the-roadmap era …