Lightweight MXene/cellulose nanofiber composite film for electromagnetic interference shielding

Z Cui, C Gao, Z Fan, J Wang, Z Cheng, Z Xie… - Journal of Electronic …, 2021 - Springer
Lightweight and high-strength materials with high electromagnetic interference shielding
performance are the best solution for electromagnetic pollution. However, the MXene film …

Microstructural evolution and recrystallization behavior of cold rolled austenitic stainless steel with dual phase microstructure during isothermal annealing

GS Sun, LX Du, J Hu, RDK Misra - Materials Science and Engineering: A, 2018 - Elsevier
In the present study, the concept of phase reversion developed by Misra's group (references
2, 4, 14–16, 25) was adopted to process a 304 austenitic stainless steel and explore the …

Influence of TiB2 particles on aging behavior of in-situ TiB2/Al-4.5 Cu composites

R Du, Q Gao, S Wu, S Lü, X Zhou - Materials Science and Engineering: A, 2018 - Elsevier
In this paper, the aging process of in-situ TiB 2/Al-4.5 Cu composites has been investigated
carefully, especially the precipitation behavior in the presence of TiB 2 particles. The …

X-ray diffraction line profile analysis of undoped and Se-doped SnS thin films using Scherrer's, Williamson–Hall and size–strain plot methods

H Kafashan - Journal of Electronic Materials, 2019 - Springer
An electrochemical route has been employed to prepare undoped and Se-doped SnS thin
films. Six samples including undoped and Se-doped SnS thin films were deposited on the …

Advances in In situ microfracture experimentation techniques: A case of nanoscale metal–metal multilayered materials

HPA Ali, A Budiman - Journal of Materials Research, 2019 - cambridge.org
Plasticity and fracture of materials at the nanoscale levels can deviate significantly from the
same phenomena in bulk properties, which may have important implications if they are to be …

Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination

WJR Song, SK Tippabhotla, AAO Tay… - Solar Energy Materials …, 2018 - Elsevier
Fracture in silicon crystalline solar cells has been a long-standing challenge encountered in
the photovoltaic (PV) industry. This occurs as result of stresses developing in the cells due to …

Enabling the measurement of thermomechanical stress in solar cells and PV modules by confocal micro-Raman spectroscopy

AJ Beinert, A Büchler, P Romer, V Haueisen… - Solar Energy Materials …, 2019 - Elsevier
Understanding the origin of thermomechanical stress in solar cells is a key factor to extend
the lifetime of photovoltaic modules. However, the methods to determine the stress are very …

Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging

Y Pan, F Li, H He, J Li, W Zhu - Microelectronics Reliability, 2017 - Elsevier
Abstract Through Silicon Via (TSV) technology is a promising and preferred way to realize
the reliable interconnection for 3D IC integration. The temperature changed in the processes …

Effect of encapsulants on the thermomechanical residual stress in the back-contact silicon solar cells of photovoltaic modules–A constrained local curvature model

SK Tippabhotla, WJR Song, AAO Tay, AS Budiman - Solar Energy, 2019 - Elsevier
The fracture of the silicon cells and associated performance degradation is a major
hindrance to the long-term viability of solar photovoltaics as a main-stream power source …

Crystallographic and mechanical investigation of intergranular stress corrosion crack initiation in austenitic stainless steel

T Fujii, K Tohgo, Y Mori, Y Miura… - Materials Science and …, 2019 - Elsevier
This study used crystallographic and mechanical analyses to investigate the nucleation of
intergranular stress corrosion cracking (IGSCC) on a smooth surface of type 304 austenitic …