Low-cycle thermal-mechanical fatigue loadings induce progressive and permanent
degradation of mechanical properties of lead-free solder materials, and thus reduce the …

Solder joints are subjected to varied stress cycle circumstances in the electronic packaging
service life but are also influenced by aging. There has been limited investigation into the …

The effects of aging on the cyclic shear stress–strain and fatigue behavior of lead-free
solders have been explored experimentally and have been presented in this paper. An …

Isothermal aging causes detrimental changes in the microstructure, mechanical response,
and failure behavior of lead free solder joints in electronic assemblies. These material …

Reliable lead free solders are needed for products exposed to extreme environments such
as those used in the automotive, avionics, and oil-exploration industries, as well as in …

Lead free solder materials are used as interconnects in electronic assemblies due to their
relatively high melting temperature, mechanical properties, and thermal cycling reliability, as …

In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …

Solder joints reliability is a determinant factor for the life of the electronic assemblies. In this
study, the reliability of actual SAC305 solder joints is investigated using accelerated shear …

Lead free solder materials are susceptible to significant creep deformations in harsh high
temperature environments including automotive, avionics, military, and oil exploration …

In this work, we have examined the ability of microalloy additions (dopants) to reduce aging
effects in solder joints by nanoindentation testing of several sets of doped/non-doped alloys …