With the development of science and technology, consumers' requirements for various
electronic devices present a trend of more diverse functions and thinner bodies. This makes …

This study aims to comprehensively understand the influence of bismuth (Bi) content on the
shear characteristics of solder joints under various aging conditions and strain rates. Three …

A test rig was developed to do high speed solder ball shear tests on a servohydraulic testing
machine. Shear tests were conducted over a range of shear rates on eutectic tin–lead and …

Recent studies demonstrate significant reductions in mechanical properties of lead-free
interconnection materials in harsh environments such as automotive and military …

Doping SAC solder joints with some elements such as Bi (bismuth) and In (Indium) has been
found to improve the thermal cycling reliability, reduce the effect of aging, and improve …

The reliability of an electronic assembly is limited by a fatigue failure of one of the
interconnected solder joints. Fatigue properties of the common lead free solder joints have …

This study compares high-speed bondtesting (shear and pull) with board level drop testing
(BLDT) of BGA packages using Sn4. 0% Ag0. 5% Cu solder balls and either an ENIG or …

Ball pull test has emerged to be an attractive alternative to the traditional ball shear method
for characterizing the attachment strength of solder interconnection. Since it is a relatively …

This study investigated brittle solder joint failure mechanisms during high-speed solder ball
shear and pull testing. BGA package samples with different solder alloys (Sn4. 0% Ag0. 5 …

The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …