Interconnect technology with h-BN-capped air-gaps
To allow air-gaps with a large void size within a metal spacing, we propose the use of h-BN
as an airgap capping layer, which suspends the inter-metal dielectric in a CMOS back-end …
as an airgap capping layer, which suspends the inter-metal dielectric in a CMOS back-end …
[PDF][PDF] 一种基于Mesh 结构的新型层次化片上网络拓扑结构
孔峰， 韩国栋， 沈剑良， 简刚 - 电子与信息学报, 2014 - edit.jeit.ac.cn
针对片上网络(NoC) 较远距离节点路由跳数较大导致的网络功耗和面积过大问题,
该文通过分析Mesh 和集中式Mesh (CMesh) 结构特性, 提出一种基于Mesh …
该文通过分析Mesh 和集中式Mesh (CMesh) 结构特性, 提出一种基于Mesh …
A novel mesh-based hierarchical topology for network-on-chip
F Kong, G Han, J Shen - 2014 IEEE 5th International …, 2014 - ieeexplore.ieee.org
As the number of modules in System-on-Chip increases, the topology is more likely to suffer
from excessive end-to-end hop-counts, causing an increase of power consumption and area …
from excessive end-to-end hop-counts, causing an increase of power consumption and area …
A multi-objective architecture optimization method for application-specific NoC design
One of the challenging problems in networks-on-chip (NoC) design is optimizing the
architectural structure of the on-chip network in order to maximize the network performance …
architectural structure of the on-chip network in order to maximize the network performance …
[引用][C] Software-based and regionally-oriented traffic management in Networks-on-Chip
P Gorski - 2016 - Dissertation, Rostock, Universität …