Bottom-up self-assembly nanofabrication process yields nanodevices with significantly more
variations compared to the conventional top-down lithography used in CMOS fabrication …

In this paper we propose an accurate and predictive interconnect density function (PIDF) for
very deep submicrometer (VDSM) integrated circuits and nano-systems using continuous …

High defect density and extreme process variation for nanoscale self-assembled crossbar-
based architectures have been expected to be as fundamental design challenges …

In hybrid nano-architectures, self-assembled nanoscale crossbars are fabricated on top of a
reliable CMOS subsystem. Bottom-up self-assembly nanofabrication process, used in nano …

With continuous scaling of integrated circuits into deep sub micron process technology,
operating at gigahertz frequencies, it has become critical to determine system performance …

In this paper, we present a methodology to explore and evaluate the crosstalk noise and the
profile of its variations, and the delay of interconnects through investigation of two groups of …

This paper proposes a new predictive method for distribution of interconnects density
function (DIDF) without any need to design layout information. Parameters such as number …

In this paper, the investigation methodology for crosstalk evaluation in two groups of
interconnect structures in nano scale VLSI circuits is presented. The first group consists of a …

In this paper a new simulation technique is proposed for interconnect structures. It is
possible in this technique to take into account the impact of interconnects in early stages of …

As integrated circuits (ICs) are scaled into nanometre dimensions and operate in gigahertz
frequencies, interconnects have become critical in determining system performance and …