Dielectric breakdown of oxide films in electronic devices

A Padovani, P La Torraca, J Strand, L Larcher… - Nature Reviews …, 2024 - nature.com
Dielectric breakdown is a sudden and catastrophic increase in the conductivity of an
insulator caused by electrical stress. It is one of the major reliability issues in electronic …

Border traps in Ge/III–V channel devices: Analysis and reliability aspects

E Simoen, DHC Lin, A Alian… - … on Device and …, 2013 - ieeexplore.ieee.org
The aim of this review paper is to describe the impact of so-called border traps (BTs) in high-
k gate oxides on the operation and reliability of high-mobility channel transistors. First, a …

Breakdown in the metal/high-k gate stack: Identifying the “weak link” in the multilayer dielectric

G Bersuker, D Heh, C Young, H Park… - 2008 IEEE …, 2008 - ieeexplore.ieee.org
We apply a systematic approach to identify a high-k/metal gate stack degradation
mechanism. Our results demonstrate that the SiO 2 interfacial layer controls the overall …

[HTML][HTML] A simple figure of merit to identify the first layer to degrade and fail in dual layer SiOx/HfO2 gate dielectric stacks

A Padovani, P La Torraca - Microelectronic Engineering, 2023 - Elsevier
Understanding the degradation dynamics and the breakdown sequence of a bilayer high-k
(HK) gate dielectric stack is crucial for the improvement of device reliability. We present a …

Exploring the capability of multifrequency charge pumping in resolving location and energy levels of traps within dielectric

M Masuduzzaman, AE Islam… - IEEE transactions on …, 2008 - ieeexplore.ieee.org
Multifrequency charge-pumping (MFCP) experiments have been used by many groups to
profile the locations and the energy levels of bulk traps within high-kappa gate dielectric …

Two-Pulse : A New Method for Characterizing Electron Traps in the Bulk of Dielectric Stacks

WD Zhang, B Govoreanu, XF Zheng… - IEEE Electron …, 2008 - ieeexplore.ieee.org
SiO_2/high-κ dielectric stack is a candidate for replacing the conventional SiO_2-based
dielectric stacks for future Flash memory cells. Electron traps in the high-κ layer can limit the …

Applications of DCIV method to NBTI characterization

A Neugroschel, G Bersuker, R Choi - Microelectronics Reliability, 2007 - Elsevier
The DCIV method was applied to investigate negative bias temperature instability (NBTI) in
SiO2 gate oxides. The DCIV technique, which measures the interface defect density …

Comprehensive study on the deep depletion capacitance-voltage behavior for metal-oxide-semiconductor capacitor with ultrathin oxides

JY Cheng, CT Huang, JG Hwu - Journal of Applied Physics, 2009 - pubs.aip.org
The deep depletion behaviors at the structure of Si/SiO 2 with various equivalent oxide
thicknesses (EOTs) are comprehensively studied by magnified capacitance versus gate …

[图书][B] Electrical characterisation of ferroelectric field effect transistors based on ferroelectric HfO2 thin films

E Yurchuk - 2015 - books.google.com
Ferroelectric field effect transistor (FeFET) memories based on a new type of ferroelectric
material (silicon doped hafnium oxide) were studied within the scope of the present work …

Temperature dependence of the emission and capture times of SiON individual traps after positive bias temperature stress

M Toledano-Luque, B Kaczer, P Roussel… - Journal of Vacuum …, 2011 - pubs.aip.org
The authors study the statistical properties of individual defects in n-type metal-oxide-
semiconductor field-effect transistors (nMOSFETs) using time dependent defect …