Electroplating Method on Copper (Cu) Substrate with Silver (Ag) Coating Applied
Knowing about metal coating (electroplating) is the electrodeposition of coatings or coatings
attached to the electrodes to protect the substrate by giving surface properties and …
attached to the electrodes to protect the substrate by giving surface properties and …
Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler
G Kim, KM Jung, JT Moon, JH Lee - Journal of the Microelectronics …, 2014 - koreascience.kr
After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal
conductivity and electrical resistivity of the paste were measured with different curing …
conductivity and electrical resistivity of the paste were measured with different curing …
A method for application of ammonium-based pretreatment solution in preparation of copper flakes coated by electroless Ag plating
JH Kim, JH Lee - Journal of the Microelectronics and Packaging …, 2015 - koreascience.kr
In order to prepare a low-cost conductive filler material possessing improved anti-oxidation
property, Ag-coated Cu flakes were fabricated and the effects of an applying method of …
property, Ag-coated Cu flakes were fabricated and the effects of an applying method of …
Microstructural investigation of the oxidation behavior of Cu in Ag-coated Cu films using a focused ion beam transmission electron microscopy technique
JH Kim, JH Lee - Japanese Journal of Applied Physics, 2016 - iopscience.iop.org
With the aim of elucidating a detailed mechanism for the oxidation behavior in submicron Cu
particles coated with a thin Ag layer, the dewetting of Ag and the oxidation behavior of Cu in …
particles coated with a thin Ag layer, the dewetting of Ag and the oxidation behavior of Cu in …
Effects of Synthetic Temperature and Amount of Oleylamine in Synthesis of Cu-Based Nanoparticles Using Heptyl Alcohol Solvent
SS Chee, JH Lee - Journal of the Microelectronics and Packaging …, 2014 - koreascience.kr
With synthesis temperature and adding amount of oleylamine, nanometer-sized Cu particles
were fabricated by heptyl alcohol-based chemical synthesis. The synthetic temperature and …
were fabricated by heptyl alcohol-based chemical synthesis. The synthetic temperature and …
[PDF][PDF] Indonesian Journal of Chemical Science and Technology
R Selly, RA Syahputra, M Zubir… - Indonesian Journal of …, 2020 - academia.edu
Knowing about metal coating (electroplating) is the electrodeposition of coatings or coatings
attached to the electrodes to protect the substrate by giving surface properties and …
attached to the electrodes to protect the substrate by giving surface properties and …
서브마이크론급구리입자의은도금공정에따른내산화성강화연구
최은별， 이종현 - 마이크로전자및패키징학회지, 2016 - dbpia.co.kr
내산화 특성을 가지는 구리 (Cu) 기반의 미세 도전 필러를 제조하기 위하여 서브마이크론급의
은 (Ag) 코팅 Cu 입자를 제조하고, 그 내산화 특성을 평가하였다. 평균 크기 0.705 μm 의 Cu …
은 (Ag) 코팅 Cu 입자를 제조하고, 그 내산화 특성을 평가하였다. 평균 크기 0.705 μm 의 Cu …
Antioxidation Behavior of Submicron-sized Cu Particles with Ag Coating
EB Choi, JH Lee - Journal of the Microelectronics and Packaging …, 2016 - koreascience.kr
To fabricate a copper (Cu)-based fine conductive filler having antioxidation property,
submicron silver (Ag)-coated Cu particles were fabricated and their antioxidation property …
submicron silver (Ag)-coated Cu particles were fabricated and their antioxidation property …
[PDF][PDF] 구리플레이크의무전해은도금에서암모늄계구리전처리용액의적용법
김지환， 이종현 - 마이크로전자및패키징학회지, 2015 - researchgate.net
내산화 특성을 가지는 저가격 도전성 필러 소재로의 적용을 위해 Ag 코팅 Cu 플레이크의
제조를 수행하면서 Cu 플레이크 표면의 산화층 제거를 위한 암모니아수 기반 전처리 용액의 …
제조를 수행하면서 Cu 플레이크 표면의 산화층 제거를 위한 암모니아수 기반 전처리 용액의 …
Ag 코팅Cu 플레이크필러를사용한도전페이스트의전기및열전도도
김가혜， 정광모， 문종태， 이종현 - 마이크로전자및패키징학회지, 2014 - dbpia.co.kr
가격적 경쟁력을 가지는 Ag 코팅 Cu 플레이크 함유 도전성 페이스트를 제조하여 경화조건에
따른 열전도도및 전기전도도 값의 변화를 측정하였다. 대기 중에서 경화시킨 시편의 경우 …
따른 열전도도및 전기전도도 값의 변화를 측정하였다. 대기 중에서 경화시킨 시편의 경우 …