MEMS inductors are used in a wide range of applications in micro-and nanotechnology,
including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies …

After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …

To address the abating performance improvements from device scaling, innovative 2.5-D
and 3-D integrated circuits with vertical interconnects called through-silicon vias (TSVs) …

This letter reports on a new low-loss and high-linearity 3-D wafer-level interposer technology
enabled by through glass vias (TGVs) with an inverted via configuration. The proposed TGV …

This article presents, for the first time, new design and fabrication techniques for Hollow
Substrate Integrated Waveguides (HSIWs), demonstrated in the nominal frequency from 21 …

In this paper, we demonstrate a novel manufacturing technology for high-aspect-ratio
vertical interconnects for high-frequency applications. This novel approach is based on …

This paper presents the wideband modeling and analysis of differential through-silicon vias
(D-TSVs) in 3-D ICs. An equivalent-circuit model of the ground-signal-signal-ground-type D …

In this paper, a high-resistivity silicon (HR-Si) interposer integrated with through-silicon via
(TSV) electrically grounded coplanar waveguide (CPW) line is presented for 2.5-D/3-D …

This study focuses on the effects of plating additives and forced convection on microstructure
and surface roughness of a copper foil at high current densities. A pilot Cu plating bath was …