Methods for producing multilayer heat sinks utilizing low temperature sintering processes
are provided. In one embodiment, the method includes forming a metal particle-containing …

Provided are integrated electronic components which include a waveguide microstructure
formed by a sequential build process and an electronic device, and methods of forming such …

A contactor device includes: a first body substrate; a second body substrate; a flexible
membrane connected to the first body substrate and second body substrate, wherein the …

A system and method for manufacturing a packaged component are disclosed. An
embodiment comprises forming a plurality of components on a carrier, the plurality of …

US10499461B2 - Thermal head with a thermal barrier for integrated circuit die processing -
Google Patents US10499461B2 - Thermal head with a thermal barrier for integrated circuit die …

Techniques, a system, and architecture are disclosed for top side transistor heat dissipation.
The heat dissipation is done through single crystal epitaxially grown layer such as AlN. The …

The invention relates to a manufacturing process for a heat dissipation heat sink composite
having heat dissipation function and a manufacturing method for a finished product thereof …

A system and method for manufacturing a packaged component are disclosed. An
embodiment comprises forming a plurality of components on a carrier, the plurality of …

Described is an apparatus which comprises: a die having a first side and a second side
opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the …

Provided are integrated electronic components which include a waveguide microstructure
formed by a sequential build process and an electronic device, and methods of forming such …