Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …

In this paper, we report the design and fabrication of fine-pitch and pixelated-addressed
micro-light emitting diode (LED) arrays with emission wavelengths of red (R), green (G), blue …

The interfacial microstructures of the Cu-wire bonding to an Al pad are investigated first by
using an X-ray microdiffractometer and high-resolution transmission electron microscopy. It …

Cu-wire overhang bonding process is investigated first by a high-speed camera system. It
was found that the greater impact, rebound, and deflection of overhang die during the Cu …

Microstructure characteristics of Cu-wire bonding interface are investigated first by using the
X-ray microdiffractometer, and the dynamic process of Cu-and Au-wire overhang bonding is …

A combination of Finite Element Analysis (FEA), Molecular Dynamics (MD) simulation and
analytical formulation is employed to predict the thickness of Intermetallic Compounds …

We found the failure mechanisms in Ag wire bonded to Al pads during the high-temperature-
storage lifetime test (HTST) and the unbiased highly-accelerated temperature and humidity …

Insulated copper wire has been widely used in many industries, but the insulating coating
must be removed before welding because it will hinder the formation of joints. Therefore, in …

Copper wire bond remains a challenge especially on bond pads with sensitive pad
metallization. Extensive work and analysis are needed at the onset of the packaging …

Quad Flat No-Lead (QFN) is one of the fastest growing semiconductor packages. It offers a
variety of advantages including near-chip scale footprint, reduced lead inductance, thin …