Electronic devices are increasingly portable, and often susceptible to damage during
handling, transportation, and service. Because of the great variety of stresses to which …

This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …

Over the past few years Sn-based solders containing third and fourth elements have
become of great interest to try and improve the consistency of solders during application. In …

This research sought to improve the properties of SAC305 solder joints by the addition of 1
and 2 wt.% Bi. The effects of bismuth doping on the microstructure, thermal properties, and …

Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs,
stacked components, or 3D configurations to ensure reliable connections and minimize …

This study investigated the fusion and phase-transformation processes of nano-intermetallic
compound (nano-IMC) mixed solder pastes. In particular, the interfacial reaction with the Cu …

The effects of Pt doping on the mechanical properties of (Cu, Pt) 6 Sn 5 interfacial
intermetallic compound (IMC), bonding properties of the (Cu, Pt) 6 Sn 5/Cu interface, and …

The influence of Ni on the size and twinning of primary Cu 6 Sn 5 crystals in Sn-0.7 Cu-0.05
Ni and Sn-xCu (x= 0.7, 0.9, 1.1)(mass%) solder joints is studied using synchrotron …

In recent years there has been increased interest in Bi-containing solders to improve the
reliability of electronics and drive down processing temperatures. When the Bi content is …

Bi additions have been reported to improve the wettability and drop-impact performance.
Most important of all, it improves the mechanical properties. However, few studies focus on …