Wet Clean Applications in Porous Low‐k Patterning Processes
QT Le, G Vereecke, H Struyf, E Kesters… - … for ULSI Technology, 2012 - Wiley Online Library
Porous low‐dielectric constant materials/Cu are used in back‐end‐of‐line (BEOL)
interconnects to reduce signal delay. Surface preparation and removal of undesired …
interconnects to reduce signal delay. Surface preparation and removal of undesired …