Packaged microelectronic elements are provided. In an exem plary embodiment, a
microelectronic element having a front face and a plurality of peripheral edges bounding the …

An integrally packaged integrated circuit device including an integrated circuit die including
a crystalline substrate having first and second generally planar surfaces and edge surfaces …

BACKGROUND Conventional techniques for isolating objects from vibra tion include large
systems having metal springs, shock absorbers, rubber gaskets, metal mesh springs, oil-or …

5,279,966 A 1/1994 Jessell et al. 5,871,969 A 2/1999 Hastings et a1. 6,287,777 B1 9/2001
Sytkowski et a1. 6,465,620 B1 10/2002 Boyle et a1. 6,569,662 B1 5/2003 Tang et a1 …

According to one aspect of the invention, there is pro vided an electro-mechanical micro-
switch device. The emectro-mechanical micro-switch device includes first and second …

An electro-mechanical switch structure includes at least one fixed electrode and a free
electrode which is movable in the structure with a voltage potential applied between each …

A MEMS device having a sensor system that is resiliently mounted on a carrier by means of
spring elements. The air gap between sensor system and carrier is reduced by a damping …

Encapsulated devices that can adjust the damping level within are provided. In this regard, a
representative encapsulated device, among others, comprises a bottom substrate, a middle …

2,507.956 A 5, 1950 Bruno et al. 2,796,370 A 6, 1957 Ostrender et al. 2,851,385 A 9/1958
Spruance et al. 3,648,131 A 3/1972 Stuby et al. 3,761,782 A 9, 1973 Youmans 3,981,023 A …

US PATENT DOCUMENTS 5,279,966 A 1/1994 Jessell et al. 5,871,969 A 2/1999 Hastings
et al. 6,287,777 B1 9/2001 Sytkowski et al. 6,465,620 B1 10/2002 Boyle et al. 6,569,662 B1 …