This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

Conductive inks have gathered increasing attention in the fabrication of next-generation
electronic devices because of their prominent compatibility and producibility. Recently …

The era of miniaturized and customized electronics requires scalable energy storage
devices with versatile shapes. From the perspective of manufacturing, direct ink writing …

Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-
based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising …

Abstract Three kinds of Cu–Ag composite paste were fabricated. We used 10 μm Cu
particles as the main component of the paste as they are significantly cheaper than Ag and …

Robust bonding of Cu quasi-nanoparticles sintering for Ag coated chip and bare copper
substrate was achieved. The effect of temperature, pressure and time on the sintering …

The development of WBG (wide bandgap) semiconductors has put forward higher
requirements for packaging and interconnection technology. Cu sintering is widely …

Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh
operating environment, three surface finishes of sputtered Ti/Ag-layers, electroless Ni-/Pt-/Ag …

Silicon carbide (SiC) devices have shown definite advantages over Si counterparts in high-
temperature, high-voltage, and high-frequency applications. To fully exploit the potentiality of …

Low-temperature copper (Cu) sinter-joining technology has attracted increasing attention in
high-power electronic device packaging because of its low material cost, good electrical and …