Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …

Purpose–The purpose of this paper is to review recent advances in fine and ultra‐fine pitch
wire bonding. Design/methodology/approach–Dozens of journal and conference articles …

In this work, we investigate the intermetallic compound formation in Cu wire bonded device.
Voids near the Cu side at the bond interface are clearly seen. Nevertheless, these voids do …

Wire bonding is the predominant mode of interconnection in electronic packaging. Gold wire
bonding has been refined again and again to retain control of interconnect technology due …

There is growing interest in Cu wire bonding for LSI interconnection due to the cost savings
and better electrical and mechanical properties. However, the scope of use for Cu bonding …

In this study, Cu wire bonds are aged at 150, 175, 250, and 350° C for time ranging from 5
min to 2000 h. The top temperature of 350° C is chosen to have the fastest kinetics, while …

The effect of bonding duration and substrate temperature on the nano-scale interfacial
structure for bonding strength were investigated using high resolution transmission electron …

Thermosonic wire bonding is a common fabrication process for connecting devices in
electronic packaging. However, when the free air ball (FAB) is compressed onto the I/O pad …

The development of novel Cu wires for thermosonic wire bonding is time consuming and the
effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An …

Ultrasonic metal welding represents a well-suited technology for various applications,
especially regarding joining of dissimilar materials or sensitive components. For electrical …