A TSV-based 3-D electromagnetic bandgap structure on an interposer for noise suppression
For efficient and broadband noise suppression in grid-type power distribution networks
(PDNs), a novel TSV-based 3-D electromagnetic bandgap (EBG) structure with an accurate …
(PDNs), a novel TSV-based 3-D electromagnetic bandgap (EBG) structure with an accurate …
Compact transverse-resonance low-pass filter with wide stop-band rejection implemented in Gallium Arsenide technology
S Chakraborty, GN Sreepada… - IEEE Journal on …, 2023 - ieeexplore.ieee.org
This work reports three designs of transverse resonance (TR)-based high-performance
compact 5-pole Butterworth low-pass filters (TR-LPFs) at the cut-off frequency () 10.5 GHz in …
compact 5-pole Butterworth low-pass filters (TR-LPFs) at the cut-off frequency () 10.5 GHz in …
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application
Through-silicon via (TSV) is becoming an optimizing interconnection to realize high density,
three-dimensional (3-D) integration system. However, its high-frequency application is …
three-dimensional (3-D) integration system. However, its high-frequency application is …
Compact Quad-band Filter with Bridged-T Coil Based on Through-Silicon Vias Technology
S Lyu, X Yin - 2023 6th International Conference on Electronics …, 2023 - ieeexplore.ieee.org
By using the lumped elements based on the bridged-T coil structure, a quad-band bandpass
filter is proposed based on Through-Silicon Via (TSV) technology. By stacking multilayer …
filter is proposed based on Through-Silicon Via (TSV) technology. By stacking multilayer …