Recent advances in isotropic conductive adhesives for electronics packaging applications

I Mir, D Kumar - International journal of adhesion and adhesives, 2008 - Elsevier
Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention
from the researchers in electronics industry as a potential substitute to lead-bearing solders …

Electrically conductive adhesives with a focus on adhesives that contain carbon nanotubes

A Santamaria, ME Muñoz… - Journal of applied …, 2013 - Wiley Online Library
On the basis of an analysis of results presented in the literature, the currently existing
knowledge about relationships between the microstructural and physical properties of hard …

Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density

HK Kim, FG Shi - Microelectronics journal, 2001 - Elsevier
The use of electrically conductive adhesives as interconnection materials in electronic
assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip …

A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications

R Zhang, K Moon, W Lin, JC Agar, CP Wong - Composites Science and …, 2011 - Elsevier
In recent years, efforts to prepare flexible highly conductive polymer composites at low
temperatures for flexible electronic applications have increased significantly. Here, we …

Investigation of the correlation between electrical conductivity and elongation at break in polyurethane-based adhesives

I Novak, I Krupa, I Chodak - Synthetic Metals, 2002 - Elsevier
Electrical conductivity and elongation at break of polyurethane (PU) filled with two different
grades of graphite, Ag-coated basalt particles and fibres were investigated in this paper …

The conduction development mechanism of silicone-based electrically conductive adhesives

Z Li, K Hansen, Y Yao, Y Ma, K Moon… - Journal of Materials …, 2013 - pubs.rsc.org
The conduction development mechanism of silicone-based electrically conductive
adhesives (Silo-ECAs) is studied. The reduction of surfactants on silver flakes by hydride in …

Direct ink writing of flexible electronics on paper substrate with graphene/polypyrrole/carbon black ink

Y Chen, L Zhou, J Wei, C Mei, S Jiang, M Pan… - Journal of Electronic …, 2019 - Springer
Direct ink writing is an interesting and attractive method to replace traditional fabrication
techniques such as etching, milling, and lithography for flexible electronics because of its …

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

FG Shi, M Abdullah, S Chungpaiboonpatana… - Materials Science in …, 1999 - Elsevier
The force–resistance relationship is investigated by considering for the first time the effect of
size distribution of metallic filler particles in anisotropic conductive adhesives. It is shown, for …

Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent

ZM Dang, B Zhang, J Li, JW Zha… - Journal of Applied …, 2012 - Wiley Online Library
Thermosetting conductive adhesive (TCA) comprised of epoxy resin E‐51 as matrix, Cu
microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers …

Temperature dependence of electrical and thermal conductivities of an epoxy-based isotropic conductive adhesive

M Inoue, H Muta, T Maekawa, S Yamanaka… - Journal of Electronic …, 2008 - Springer
The temperature dependence of the transport properties, including electrical and thermal
conductivities, of a practical isotropic conductive adhesive (ICA) including an epoxy-based …