Recent advances in isotropic conductive adhesives for electronics packaging applications
I Mir, D Kumar - International journal of adhesion and adhesives, 2008 - Elsevier
Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention
from the researchers in electronics industry as a potential substitute to lead-bearing solders …
from the researchers in electronics industry as a potential substitute to lead-bearing solders …
Electrically conductive adhesives with a focus on adhesives that contain carbon nanotubes
A Santamaria, ME Muñoz… - Journal of applied …, 2013 - Wiley Online Library
On the basis of an analysis of results presented in the literature, the currently existing
knowledge about relationships between the microstructural and physical properties of hard …
knowledge about relationships between the microstructural and physical properties of hard …
Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density
HK Kim, FG Shi - Microelectronics journal, 2001 - Elsevier
The use of electrically conductive adhesives as interconnection materials in electronic
assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip …
assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip …
A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications
In recent years, efforts to prepare flexible highly conductive polymer composites at low
temperatures for flexible electronic applications have increased significantly. Here, we …
temperatures for flexible electronic applications have increased significantly. Here, we …
Investigation of the correlation between electrical conductivity and elongation at break in polyurethane-based adhesives
Electrical conductivity and elongation at break of polyurethane (PU) filled with two different
grades of graphite, Ag-coated basalt particles and fibres were investigated in this paper …
grades of graphite, Ag-coated basalt particles and fibres were investigated in this paper …
The conduction development mechanism of silicone-based electrically conductive adhesives
Z Li, K Hansen, Y Yao, Y Ma, K Moon… - Journal of Materials …, 2013 - pubs.rsc.org
The conduction development mechanism of silicone-based electrically conductive
adhesives (Silo-ECAs) is studied. The reduction of surfactants on silver flakes by hydride in …
adhesives (Silo-ECAs) is studied. The reduction of surfactants on silver flakes by hydride in …
Direct ink writing of flexible electronics on paper substrate with graphene/polypyrrole/carbon black ink
Y Chen, L Zhou, J Wei, C Mei, S Jiang, M Pan… - Journal of Electronic …, 2019 - Springer
Direct ink writing is an interesting and attractive method to replace traditional fabrication
techniques such as etching, milling, and lithography for flexible electronics because of its …
techniques such as etching, milling, and lithography for flexible electronics because of its …
Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles
FG Shi, M Abdullah, S Chungpaiboonpatana… - Materials Science in …, 1999 - Elsevier
The force–resistance relationship is investigated by considering for the first time the effect of
size distribution of metallic filler particles in anisotropic conductive adhesives. It is shown, for …
size distribution of metallic filler particles in anisotropic conductive adhesives. It is shown, for …
Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Thermosetting conductive adhesive (TCA) comprised of epoxy resin E‐51 as matrix, Cu
microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers …
microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers …
Temperature dependence of electrical and thermal conductivities of an epoxy-based isotropic conductive adhesive
M Inoue, H Muta, T Maekawa, S Yamanaka… - Journal of Electronic …, 2008 - Springer
The temperature dependence of the transport properties, including electrical and thermal
conductivities, of a practical isotropic conductive adhesive (ICA) including an epoxy-based …
conductivities, of a practical isotropic conductive adhesive (ICA) including an epoxy-based …