Due to the advantages of joint level tests, such as low cost and flexibility, it is always
desirable to predict the board level pad cratering strength by a joint level test. In order to …

Pad cratering is one of the major failure modes encountered during PCB assembly and
operation. Fracture is generally mechanically induced between the outermost layer of board …

A comprehensive experimental study on the brittle fracture of intermetallic compounds
(IMCs) of a Pb-free solder was performed and presented in this paper. The solder joints …

The root causes of pad cratering may be divided into two categories, namely, overloading
induced pad cratering and fatigue induced pad cratering. The former occurs when the …

Repeated loading is an important reason to cause pad cratering fatigue failure in ball grid
array (BGA) device in printed circuit board (PCB) assembly. For industry application, the …

Conventional reliability tests for the evaluation of pad cratering resistance are mainly
classified into two categories: the board level test and the joint level test. The board-level test …

Pad cratering is a mechanically induced fracture in the resin between the copper foil and the
outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at …

Post-reflow residual strain is a typical thermo-mechanical phenomenon of printed circuit
board assemblies (PCBA) with a large ball grid array (BGA) component after the surface …

Warpage deformation under thermal loading has been a well-known problem in plastic ball
grid array (PBGA) packages because of their overmold structure and thin substrate. The …

Solder cracking is one of the dominant failure modes of the electronic assembly system.
Experience shows that solder joints can fail due to processing defects during solder joint …