In the ever-growing landscape of electrical power demand, the future of power electronics
module packaging lies in the realm of wide-bandgap (WBG) materials, including silicon …

In the applications of offshore wind turbines and high-speed trains, the power electronic
devices suffer in harsh working conditions of high humidity. The moisture invades devices …

Trends toward high power density designs and emerging wide bandgap (WBG)-based
semiconductors will lead to a severe temperature rise in power electronic modules. In this …

Medium-voltage silicon carbide (SiC) power modules are a critical component in grid-bound
power conversion systems, and the packaging of these modules dictates the performance …

Insulated gate bipolar transistors (IGBTs) find applications in diverse fields, such as
integrated motor drives, controllable power systems, and electric vehicles. However …

This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power
module packaging with optimized electrical and thermal performances. The structure of the …

The future of packaging for power modules hinges on the advancement of (U) WBG)
materials like SiC, AlN, and diamond. However, pushing these boundaries faces significant …

HFO-1336mzz (E) is considered a potential eco-friendly insulating gas, with a low global
warming potential and high dielectric strength. This study investigates the insulation …

The lack of a method to select the suitable silicone gel from various commercial silicone gels
for encapsulation in next-generation high-voltage high-power electronics modules has …

In medium voltage (MV) and high voltage (HV) applications, HV SiC mosfet with a single
chip competes with series-connected low voltage (LV) SiC mosfet. The cost of the former is …