Sintered Cu interconnection for power electronics has attracted considerable interest
recently. Investigation of grain growth during Cu nanoparticle sintering provides insight into …

The rapid development of the third-generation semiconductors has posed new requirements
and challenges for power electronic packaging. In recent years, the utilization of nano-Ag …

As a promising technology for high-power and high-temperature power electronics
packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention …

A kind of interface between power chip and heat sink with high interfacial strength and high
thermal conductivity was sintered by different Ag particles in this article. The results showed …

Ag sinter pastes comprising Ag nano/microparticles in an organic binder exhibit many
advantages for electronic packaging, such as a low sintering temperature (< 300° C), high …

Thermal stress caused by the coefficients of thermal expansion (CTE) mismatch of materials
is the main failure mechanism in power electronic packaging. High junction temperature (T j) …

Nano-Ag sintering can realize superior thermal, electrical, and mechanical properties for
power electronic packaging, while it suffers from unstable microstructure and …

Compared with conventional solders, nano-silver benefits low-temperature sintering and
high-temperature service, perfectly matching the high-temperature operating environment …

In this work, a low-temperature and low-pressure method was proposed for the bonding
strength enhancement of SiC chips and substrates using micro/nanostructures fabricated by …

Effective thermal conductivity (ETC) of sintered Ag is an essential parameter for its die-attach
application in power electronics packaging, which could vary significantly with sintering …