A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints
This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …
Brazing of high-strength steels: Recent developments and challenges
Zinc-coated high-strength steels (HSS) and advanced high-strength steels (AHSSs) are
widely employed in automobile body manufacturing owing to their impressive metallurgical …
widely employed in automobile body manufacturing owing to their impressive metallurgical …
[HTML][HTML] Improvements of surface tribological properties by magnetic assisted ball burnishing
ZF Kovacs, ZJ Viharos, J Kodácsy - Surface and Coatings Technology, 2022 - Elsevier
The effect of the magnetic assisted ball burnishing on a general, C45 steel was investigated
considering tribological aspects. In engineering practice, the tribological properties of …
considering tribological aspects. In engineering practice, the tribological properties of …
Study on micro-arc oxidation coating of copper pretreated at high temperature
Z Liu, H Lu, X Dai, B Cheng, A Zhou - Journal of Alloys and Compounds, 2024 - Elsevier
Abstract Micro-arc oxidation (MAO), also known as plasma electrolytic oxidation (PEO), is a
surface treatment technology widely used in valve metals. As a widely used non-valve metal …
surface treatment technology widely used in valve metals. As a widely used non-valve metal …
Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC)
layer formation of Sn-3.0 Ag-0.5 Cu (SAC305)/CNT/Cu solder joint according to the …
layer formation of Sn-3.0 Ag-0.5 Cu (SAC305)/CNT/Cu solder joint according to the …
Experimental studies of different strength steels MIG brazed joints
M Berczeli, Z Weltsch - Periodica Polytechnica Transportation …, 2018 - pp.bme.hu
Nowadays the stakeholders of vehicle industry are focusing on making materials and
technologies for motor-vehicle bodies that satisfy the newest requirements. Reduction of the …
technologies for motor-vehicle bodies that satisfy the newest requirements. Reduction of the …
Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
D Straubinger, A Geczy, A Sipos, A Kiss, D Gyarmati… - Circuit World, 2019 - emerald.com
Purpose This paper aims to present a novel approach on investigating critical current
densities in the solder joints of chip-size surface-mounted components or device (SMD) …
densities in the solder joints of chip-size surface-mounted components or device (SMD) …
Wetting of laser-textured tungsten substrate by molten tin
R Sui, J Tong, Z Zhang, Q Lin - Surfaces and Interfaces, 2024 - Elsevier
In the new generation of nuclear reactors, plasma facing components tend to be designed
as Sn/W composite components. Considering the combination of tin and tungsten, the …
as Sn/W composite components. Considering the combination of tin and tungsten, the …
Effects of Dy substitution for Sn on the solderability and mechanical property of the standard near eutectic Sn–Ag–Cu alloy
HM Chen, J Liao, S Wu, L Gong, J Wang… - Journal of Materials …, 2018 - Springer
In this study, the solderability of Sn–3.5 Ag–0.5 Cu–xDy solders were investigated and the
shear strength properties of joints with Cu substrate were investigated. The results indicated …
shear strength properties of joints with Cu substrate were investigated. The results indicated …
Effects of high current density on lead-free solder joints of chip-size passive SMD components
Purpose The purpose of this paper is to present a novel approach on investigating critical
current densities in the solder joints of chip-size surface mounted device (SMD) …
current densities in the solder joints of chip-size surface mounted device (SMD) …