Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips
R Hu, M Huang, L Lu, F Yang, J Lin, K Ma… - IEICE Electronics …, 2024 - jstage.jst.go.jp
Abstract Three-dimensional (3D) integration based on through silicon via (TSV) is one of the
most promising technologies in the post-Moore Era. However, increased power density will …
most promising technologies in the post-Moore Era. However, increased power density will …
A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in s-parameter
In this study, the effects of the frequency-dependent characteristics of through-silicon vias
(TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection …
(TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection …