New interconnect materials are always necessary as a result of evolving packaging
technologies and increasing performance and environmental demands on electronic …

As an alternative to lead-bearing solder, isotropic conductive adhesives (ICA) have been
utilized for many years in microelectronic packaging. In this study, silver nitrate (AgNO3) as …

A general analytical expression for the size-dependent constriction (contact) resistance is
obtained for non-quantum contacts of arbitrary size as a solution of Laplace's equation with …

Abstract LiFePO 4 electrodes, composed of 5% PVDF and 5% carbon, were coated on
aluminum foil. The LiFePO 4 electrodes were calendered to 2.5 g cm− 3. A comparison of …

Conductive polymer composites are manufactured by randomly dispersing conductive
particles along an insulating polymer matrix. Several authors have attempted to model the …

By varying the concentration of surfactant in reverse micelle system, Ag particles from 10 to
200nm in average diameter were synthesized, which have been characterized by X-ray …

Force Sensing Resistors (FSRs) are manufactured by sandwiching a Conductive Polymer
Composite (CPC) between metal electrodes. The piezoresistive property of FSRs has been …

The use of electrically conductive adhesives as interconnection materials in electronic
assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip …

Anisotropic conductive adhesive (ACA) assembly is emerging as one of the most flexible
and cost effective packaging interconnect methods in the microelectronics industry. One of …

A new theory is introduced for the onset of electrical conduction in isotropic conductive
adhesives, based on the observation that conduction is a result of the creation of conducting …