Recently, the need for miniaturization and high integration have steered a strong technical
wave in developing (micro‐) electronic devices. However, excessive amounts of heat may …

We review the current state-of-the-art graphene-enhanced thermal interface materials for the
management of heat in the next generation of electronics. Increased integration densities …

The rapid development of integrated circuits and electronic devices creates a strong
demand for highly thermally conductive yet electrically insulating composites to efficiently …

Fluorine-containing polyimide (PI) with low dielectric constant (ε) value was firstly
synthesized by a polycondensation reaction of 4, 4-(hexafluoroisopropyl) diphthalic …

The developments of next‐generation electric power systems and electronics demand for
high temperature (≈ 150° C), high energy density, high efficiency, scalable, and low‐cost …

Two-dimensional hexagonal boron nitride (2D-hBN) is an emerging 2D material that has
received considerable attention due to its exceptional properties including electric …

With the development of electronic devices such as integrated circuits toward the continual
increase in power density and consumption, the efficient heat dissipation and low thermal …

With the decreased sizes of microelectronic devices, the excess heat has become one of the
most important factors that shorten the lifetime of electronic components. As a result …

Abstract Reactive Powder Concrete is a type of ultra-high-performance concrete.
Improvement of microstructure, elimination of coarse aggregate, particle packing, and …

Owing to its unique properties, such as electrical insulation, high thermal conductivity, high
breakdown strength, physical and chemical stability, boron nitride has been used widely as …