Various embodiments of fanout packages are disclosed. A method of forming a
microelectronic assembly is disclosed. The method can include bonding a first surface of at …

Apparatuses and methods are described. This apparatus includes a bridge die having first
contacts on a die surface being in a molding layer of a reconstituted wafer. The reconstituted …

According to an embodiment of the present invention, there is provided a semiconductor
device having a first semicon ductor component and a second semiconductor component …

(57) ABSTRACT A semiconductor structure includes a first die including a first surface and a
second surface opposite to the first surface; a molding surrounding the first die; a first via …

(57) ABSTRACT A semiconductor package includes a substrate, a rewiring layer, a plurality
of semiconductor chip stack structures, and a second semiconductor chip. The rewiring layer …

Apparatuses and methods are described. This apparatus includes a bridge die having first
contacts on a die surface being in a molding layer of a reconstituted wafer. The reconstituted …

An electronic device package includes a package substrate, an interposer located above the
package substrate and elec trically connected to the package substrate, a processing device …

Multiple component package structures are described in which an interposer chiplet is
integrated to provide fine routing between components. In an embodiment, the inter poser …

Direct bonding heterogeneous integration packaging structures and processes include a
packaging substrate with first and second opposing surfaces. A trench or a pedestal is …

A cryogenic electronic package includes a first superconducting multi-chip module (SMCM),
a superconducting interposer, a second SMCM and a superconducting semiconductor …