Mixed-dimensional modeling of delamination in rare earth-barium-copper-oxide coated conductors composed of laminated high-aspect-ratio thin films

P Gao, WK Chan, X Wang… - … Science and Technology, 2018 - iopscience.iop.org
Rare earth-barium-copper-oxide (REBCO) coated conductors are promising conductors for
high energy, high field and high temperature superconducting applications. In the case of …

Modelling of delamination due to hydraulic shock when piercing anisotropic carbon-fiber laminates using an abrasive waterjet

J Schwartzentruber, JK Spelt, M Papini - International Journal of Machine …, 2018 - Elsevier
Abrasive waterjet (AWJ) piercing of composite laminates typically generates interlaminar
delamination due to the hydraulic shock ('water hammer') associated with liquid jet impact …

[HTML][HTML] Characterizing and modelling delamination of carbon-fiber epoxy laminates during abrasive waterjet cutting

J Schwartzentruber, M Papini, JK Spelt - Composites Part A: Applied …, 2018 - Elsevier
Delamination is a common defect when abrasive waterjet (AWJ) cutting composite
laminates. This paper presents experimental and numerical results used to characterize …

Simulation and experimental investigation on active thermography test of the solder balls

L Zhao, Z He, Z Wang, L Su, X Lu - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
The miniaturized electronic products require not only high density, but also high reliability.
Defect inspection for the high-density package becomes challenging gradually. In this …

Fracture prediction of solder joints using two-parameter fracture mechanics

S Mirmehdi, A Nourani, A Assempour - Engineering Fracture Mechanics, 2023 - Elsevier
Two-parameter fracture mechanics theory is a novel approach to investigate the fracture
behavior of solder joints. The present study showed that the single-parameter fracture …

Effect of thermal treatment on fracture behavior of solder joints at various strain rates: Comparison of cyclic and constant temperature

S Honarvar, A Nourani, M Karimi - Engineering Failure Analysis, 2021 - Elsevier
Abstract Fracture tests on Sn93Pb37 solder joints in a double cantilever beam (DCB)
configuration were performed at two different strain rates of 10− 5 and 0.03 s− 1 under mode …

Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7 Cu solder joints

VP Sharma, NV Datla - Engineering Failure Analysis, 2022 - Elsevier
In this research, cohesive parameters were extracted for Sn-0.7 Cu/Cu solder joint failure.
Double cantilever beam (DCB) specimens were used to study the fracture of the joint under …

Main and interaction effects of manufacturing variables on microstructure and fracture of solder-copper connections

M Mohammadiamiri, A Nourani, GH Farrahi - Engineering Failure Analysis, 2022 - Elsevier
Finding the optimized set of manufacturing parameters to produce strong solder-copper
connections requires investigating the main and interaction effects of processing variables …

Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling

SY Jo, GJ Sim, EJ Park, J Park, JY Won, H Kim… - Heliyon, 2024 - cell.com
With the increasing demand for highly efficient lighting in the automotive industry, flip-chip
light-emitting diodes (LEDs) have become widely used for both interior and exterior lighting …

Predicting fracture of solder joints with different constraint factors

A Nourani, S Mirmehdi, G Farrahi… - Fatigue & Fracture of …, 2019 - Wiley Online Library
Double cantilever beam (DCB) specimens of 2.5‐mm‐long SAC305 solder joints were
prepared with thickness of copper adherends varying from 8 to 21 mm each. The specimens …