The article provides a review of the state-of-art non-destructive testing (NDT) methods used
for evaluation of integrated circuit (IC) packaging. The review identifies various types of the …

Abstract “Industry 4.0” stands for the fourth industrial revolution, the transition from
production by computer controlled isolated machines to the concept of a smart factory …

Detection of wafer/die crack after the wafer dicing process is important for yield rate control
prior to packaging. The traditional approach of microscopic examination is done after the …

This paper reports new methods of detecting damages and failures in packaging
interconnects in fully packaged devices with sufficient sensitivity and selectivity for damages …

Micro-technology plays an important role in everyday life, without being much perceived.
Cell phones, for instance, are daily equipped with small electronic components, which must …

As mentioned previously in this book, the objective of electronic packaging is to provide
conducting paths for signal distribution and power transmission between the outside world …

For both the electronics manufacturer and consumer, reliability is an essential characteristic
defining the quality of the electronic component and system. Gradual degradation of the …

This chapter provides a description of failure analysis mechanisms for electronic packaging
materials exposed to extreme environments, following a brief introduction to the concepts of …