Hot deformation characteristics and dynamic recrystallization mechanisms of a Co–Ni-based superalloy

L Ouyang, R Luo, Y Gui, Y Cao, L Chen, Y Cui… - Materials Science and …, 2020 - Elsevier
The hot deformation behavior of a Co–Ni-based superalloy was systematically investigated
using thermal compression tests. Stress–strain curves showed a typical dynamic softening …

Interfacial voids and microstructure evolution, bonding behavior and deformation mechanism of TC4 diffusion bonded joints

Y Peng, J Li, Z Li, S Li, W Guo, X Gao… - Journal of Manufacturing …, 2022 - Elsevier
The interfacial voids closure and related microstructure evaluation of diffusion bonding
process was studied by the method of combining simulation and experiment on TC4 joints. It …

Interface microstructure and bonding mechanisms of 7050 aluminum alloy thick plates produced by vacuum roll cladding

X Zhang, Z Luo, G Xie, H Yu, Z Liu, J Yang - Materials Science and …, 2022 - Elsevier
Vacuum roll cladding (VRC) based on friction stir welding (FSW) is applied to prepare
aluminum alloy thick plates, and the effect of rolling reduction ratios (60%, 70%, 80%) on the …

Fusion of theory and data-driven model in hot plate rolling: A case study of rolling force prediction

Z Dong, X Li, F Luan, L Meng, J Ding… - Expert Systems with …, 2024 - Elsevier
As one of the most critical variables in the hot rolling process, the accuracy of rolling force
prediction is directly associated with production stability and product quality. Purely data …

Effect of thermo-mechanical processing parameters on the dynamic restoration mechanism in an Mg-4Y-2Nd-1Sm-0.5 Zr alloy during hot compression

Y Gui, L Ouyang, Y Xue, Q Li - Journal of Materials Science & Technology, 2021 - Elsevier
Microstructure evolution and dynamic restoration mechanism of solution-treated Mg-4Y-2Nd-
1Sm-0.5 Zr alloy have been studied under three TMP parameters consisting of deformation …

Dependence of interfacial bonding behavior on strain rate in CoCrFeMnNi high-entropy alloy joints produced by vacuum hot-compression bonding

C Li, S Wang, J Chen, C Yu, K Zhang, H Lu - Materials Science and …, 2023 - Elsevier
Vacuum hot-compression bonding (VHCB) is a highly competitive solid-state bonding
technology. To expand the application prospects of VHCB in high-entropy alloys (HEAs), the …

A study of solid-state bonding-by-hot-deforming mechanism in Inconel 718

Y Wang, Y Liu, SD Pay, B Lan, J Jiang - Journal of Materials Processing …, 2021 - Elsevier
Solid-state bonding shows irreplaceable advantages in joining similar and dissimilar
materials with poor weldability compared with fusion welding methods. To widen its …

Interfacial oxide evolution and mechanical properties of 7050 aluminum alloy clad plates during solution and aging process

X Zhang, Z Luo, Z Liu, M Wang, H Yu, H Wang… - Materials Science and …, 2022 - Elsevier
In order to investigate interfacial oxide evolution of 7050 aluminum alloy clad plates during
the subsequent heat treatment and the effect on mechanical properties, the clad plates were …

Influence of interfacial dislocation network on strain-rate sensitivity in Ni-based single crystal superalloys

X Li, C Han, X Yue, S Li, J Li, H Zong, X Ding, J Sun - Scripta Materialia, 2024 - Elsevier
The excellent mechanical properties of Ni-based superalloys rely on their unique two-phase
microstructure. Here we probe the influence of interfacial dislocation network on strain-rate …

Exploring microstructure refinement and deformation mechanisms in severely deformed LPBF AlSi10Mg alloy

P Snopiński - Journal of Alloys and Compounds, 2023 - Elsevier
Abstract An additively produced AlSi10Mg aluminium alloy was post-processed by Equal
Channel Angular pressing at 150 ºC. This resulted in a fabrication of the novel …