Wireless sensor nodes (WSNs) and embedded microsystems have recently gained
tremendous traction from researchers due to their vast sensing and monitoring applications …

In industries such as aerospace and automotive, drilling many holes is commonly required
to assemble different structures where machined holes need to comply with tight geometric …

Purpose The research on lead-free solder alloys has increased in past decades due to
awareness of the environmental impact of lead contents in soldering alloys. This has led to …

Pin-in-paste technology is an advanced and constantly developing assembly method, where
both the surface mounted and through-hole components are joined commonly with the same …

Titanium and its alloys are largely used in various applications due its prominent mechanical
properties. However, the machining of titanium alloys is associated with assured challenges …

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the
problems associated with the growth formation of intermetallic compounds need further …

Purpose Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead
solders in microelectronics packaging due to their acceptable properties. However, to …

The mechanical and fatigue properties of microelectronic interconnection materials are
important issues in critical applications in the life of electronic assemblies. Due to the growth …

Purpose This study aims to evaluate the effect of thermal aging temperature on the
properties of Cu/Cu joints. Design/methodology/approach A new method that 1 um Zn …

Recently, titanium and its alloys have been widely used in industry. Titanium alloys are
difficult to machine due to high tool wear, cutting temperature, and edge formation. Thus, this …