Background Corrosion is a challenging and potentially harmful process that involves the
continuing, impulsive deterioration of metallic structures via reactions involving …

This review article underscores the critical role of Density Functional Theory (DFT) in the
prediction of corrosion defect structures based on specific chemical compositions. By …

The chemical mechanical polishing (CMP) process for cobalt (Co) interconnects is essential
for the fabrication of integrated circuits with feature sizes below 10 nm. However, achieving …

Cobalt is emerging as the next-generation interconnect material to replace copper for
integrated circuit sub-10 nm technology nodes. Due to its susceptibility to corrosion …

Good adhesive strength and joint durability are necessary for aluminum (Al)/polymer
laminated film for lithium-ion battery packages. A modified propylene-based elastomer …

This study presents a novel approach using colloidal silica and organic salt additives for
ultra-precision processing of GaN films. The chemical mechanical polishing (CMP) process …

Co is expected to replace Cu as the next generation of interconnect metal material and plays
an integral role in the field of integrated circuits (IC). However, the reaction mechanism …

Cobalt is a potential substitute for copper as local interconnects in sub-10 nm interconnects,
the chemical mechanical polishing (CMP) of which is quite challenging due to the high …

Copper corrosion poses a significant challenge to process stability and chip quality in the
field of integrated circuit manufacturing. This study comprehensively explored the corrosion …

Good adhesive strength and joint durability are necessary for aluminum (Al)/polymer
laminated film for lithium-ion battery packages. A pretreatment method involving alkaline …