Low-temperature copper (Cu) sinter-joining technology has attracted increasing attention in
high-power electronic device packaging because of its low material cost, good electrical and …

The rapid development of the third-generation semiconductors has posed new requirements
and challenges for power electronic packaging. In recent years, the utilization of nano-Ag …

Diamond has the highest thermal conductivity among naturally occurring materials and a
relatively low coefficient of thermal expansion (CTE), making it a promising interconnected …

Pressure-assisted sintering (PAS) utilizing bimetallic core–shell nanoparticles (CS NPs) has
garnered widespread attention for its ability to produce advanced components with excellent …

Resin-reinforced Ag sintering materials represent a promising solution for die-attach
applications in high-power devices requiring enhanced reliability and heat dissipation …

Even though dropwise condensation (DWC) has received significant attention for its
potential to enhance heat transfer performance at a higher order than filmwise condensation …

Achieving high strength and reliable bonding below 150° C using Ag nanoparticle pastes is
still a challenge. This work developed an organic-free nano-Ag multilayer film consisting of a …

Boron nitride (BN) nanomaterials are widely employed to enhance the physical properties of
materials and are well-known in the design of composite structures. In this paper, molecular …

This paper aims to comprehensively evaluate the shear strength of various junctions
between diamond chips and double copper bonded ceramic substrates. The study involves …

Copper foils demonstrate a tendency for self-annealing, which adversely impacts the
stability of the products. The self-annealing induced recrystallization of copper foil is closely …