Nanofluids are often able to provide a method to increase the possible heat transfer of a
system, with relatively few detrimental factors created by its inclusion. The use of nanofluids …

With the rapid development in the electronics industry, the thermal management of high
power density electronic products (HPDEPs) has become very important and requires …

The optimized structures for the liquid-cooled microchannel heat sinks with different pin-fin
arrays were designed via using the topology optimization method for the better performance …

Targeted at improving microfluidic cooling for the use of micro heat sink in electronic chips, a
novel fin-shaped pin-fin array heat sink is proposed. In this study, the mechanism of flow and …

Solving the heating problem of electronic systems, whose performance and power
consumption increase with the developing technology, has been the common research topic …

Nanofluid is a new class of fluid that aims to enhance heat transfer. Nanoparticles
sedimentation may play a role in the heat extractions from a hot surface. Brownian and …

In the present work, convective heat transport through an annular duct fully filled with a
bidisperse porous medium (BDPM) is analytically studied by using the two-velocity two …

Jet impingement cooling is deemed an excellent choice for the thermal management of high‐
power electronics. However, high‐pressure drop penalties and low local heat transfer …

By combining organic materials with metal materials, it is easy to obtain new composite
materials with excellent properties. Here, an excellent performance aluminum foam epoxy …

A kind of Y‐shaped bionic microchannel (YBMC) heat sink is proposed and designed based
on bionic concept and constructal law. A discontinuous Galerkin finite element method is …