Power-aware through-silicon-via minimization by partitioning finite state machine with datapath
This paper proposes an extended Finite State Machine with Datapath (FSMD) partitioning
that performs three-dimensional (3D) high level synthesis (HLS) with objectives to minimize …
that performs three-dimensional (3D) high level synthesis (HLS) with objectives to minimize …
[PDF][PDF] 低热梯度导向的三维FPGA 互连通道网络架构研究
高丽江， 杨海钢， 张超 - 电子与信息学报, 2019 - jeit.ac.cn
低热梯度导向的三维FPGA互连通道网络架构研究Research into Low Thermal Gradient
Oriented 3D FPGA Interconnect C Page 1 低热梯度导向的三维FPGA互连通道网络架构研究 高 …
Oriented 3D FPGA Interconnect C Page 1 低热梯度导向的三维FPGA互连通道网络架构研究 高 …
[PDF][PDF] Architectures and EDA for 3D FPGAs
HOU JUNSONG - 2014 - core.ac.uk
Research on 3D IC design is actively conducted for its high logic density and excellent
performance, compared with conventional 2D Integrated Circuit (IC) design. In this study, we …
performance, compared with conventional 2D Integrated Circuit (IC) design. In this study, we …
Research into Low Thermal Gradient Oriented 3D FPGA Interconnect Channel Architecture Design
L GAO, H YANG, C ZHANG - 电子与信息学报, 2019 - jeit.ac.cn
To solve the problem of heat dissipation in Three Dimensional Field Programmable Gate
Array Technology (3D FPGA), an interconnect channel architectural design method with low …
Array Technology (3D FPGA), an interconnect channel architectural design method with low …