The evolution of electronic packaging technology towards the adoption of glass substrates
marks a significant advancement in overcoming the constraints posed by traditional organic …

Purpose This paper aims to propose a method to quickly set the heating zone temperatures
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …

The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This
exponential growth has led to research and development of co-packaged optics (CPO) …

This study investigated the impact of an adhesion layer on Through Glass Via (TGV)
samples and studied the creep behavior of copper TGVs. TGV samples with and without an …

This paper demonstrates design guidelines and development of a novel 3D Heterogenous
Integration (3DHI) thin glass substrate-based half-bridge switching power module for future …

A reliable constitutive model for copper is important for simulating the thermomechanical
behavior of copper through glass via (TGV) in the glass interposer. This study presents a …

Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

The interconnections and chips of the internal components of electronic devices need to be
protected to prevent damage during shipping, handling, and daily use. This article studied …

Residual stress has been a big concern during the fabrication and assembly which may
damage the electronic device or shorten the device's lifetime. Several methods have been …

As the industry moves towards miniaturization of electronics, the need for higher accuracy in
in-plane and out-of-plane deformation measurement techniques keeps increasing. Due to a …