Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of
LEDs typically on a Sub strate. Pedestals are deposited on the LEDs with each of the …

Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of
LEDs typically on a sub strate. Pedestals are deposited on the LEDs with each of the …

Embodiments disclosed herein provide optical systems uti lizing photon conversion
materials in conjunction with a light source and an LED. An LED can be positioned in a …

4,728,999 4,740,259 4,799,136 4,841,344 4,966,862 5,036,339 5,087,949 5,114,513
5,126,929 5,151,718 5,174,649 5,218,216 5,233,204 5,251,117 5,272,108 5,278.433 …

Embodiments provide an LED comprising a quantum well region operable to generate light
and a substrate having an interface with the quantum well region, wherein light generated …

Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip
mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over …

It is an object of the present invention to provide a highly reliable and high-quality
semiconductor element by effectively preventing the migration of silver to a nitride …

A flip-chip electrode light-emitting element formed by multilayer coatings where a translucent
conducting layer and a highly reflective metal layer acts as flip-chip electrode for enhancing …

HOIL 33/54(2010.01)(52) US Cl.(57) ABSTRACT CPC.............. HOIL 33/508 (2013.01); HOIL
33/44 Methods are disclosed including applying a conformal coat ing to multiple light …

(57) ABSTRACT A light emitter device, package, or lamp that comprises and light emitter
and a light transmission control material to mask the appearance of at least the light emitter …