We present a thermo-mechanical characterization of organic substrates that accounts for
heterogeneity both in the in-plane and out-of-plane directions. Systematic observation of the …

Printed circuit boards (PCB) are designed and manufactured with a variety of polyamide
materials such as solder mask, metallic material such as copper trace, composite materials …

This paper presents a simulation method for the warpage that take places after the
patterning process of printed circuit boards. To conduct an efficient as well as realistic …

This paper presents a thermal fluid–structure interaction (FSI) study of printed circuit boards
(PCBs) during wave soldering. The influences of PCB thickness on displacement, stress and …

Laminate substrates in advanced IC packages serve as not only the principal heat
dissipation pathway but also the critical component governing the thermomechanical …

Industrial printed circuit boards (PCBs) are nonhomogeneous and anisotropic composites
consisting of copper traces, glass-reinforced epoxy laminate (FR-4), solder mask, vias, and …

In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was
performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) …

Purpose This study aims to simulate molded printed circuit board (PCB) warpage behavior
under reflow temperature distribution. Simulation models are used to estimate dynamic …

The warpage of the package substrate mainly originates from the material property and size
variations of individual components, especially when multiple components are involved. To …

Four polymers with heteroaromatic structures were synthesized starting from
dichloroanhydride of 2, 2/‐biquinoline‐7, 7/‐dicarboxylic acid. These are imide‐containing …